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July 9, 2007

Industry Legend to Receive Sigma Xi's 2007 Monie A. Ferst Award

C. P. Wong RESEARCH TRIANGLE PARK, NC - C. P. Wong at the Georgia Institute of Technology is an industry legend who fundamentally changed semiconductor packaging technology, pioneering new materials ranging from polymers to nanotechnologies.

This fall, he will receive Sigma Xi's 2007 Monie A. Ferst Award, given annually to an educator in engineering or science who has made "notable contributions to the motivation and encouragement of research through education."

The award consists of a medal and $5,000 and recognizes those who have inspired their students to significant scientific achievements. The award is administered by the Georgia Tech Chapter of Sigma Xi, of which Wong is a past president.

Wong is a Regents Professor and holder of the Charles Smithgall Institute Endowed Chair at Georgia Tech's School of Materials Science and Engineering. He dramatically reduced the cost of manufacturing large volumes of the high-performance electronic components widely used in today's telecommunications, computer networks and other consumer electronics areas. While a staff member at AT and T Bell Labs in Princeton, New Jersey, he pioneered the use of silicone gel and other polymers as a device encapsulant, allowing AT and T to save tens of millions of dollars in manufacturing costs.

In the late 1980s, he was instrumental in initiating the use of more reliable and economical, non-hermetic polymeric materials over conventional hermetic ceramic packages at the IEEE Gel Task Force, which consisted of a dozen major U.S. military suppliers and the U.S. Air Force.

In the past 10 years since joining Georgia Tech, he has advised numerous graduate and undergraduate students and mentored many postdocs. Over 400 manuscripts have been submitted from work in which Wong and his students participated. He has also made more than 250 presentations and 36 U.S. Patent applications during this period. Wong is the author or co-author of four definitive books on polymeric materials and packaging technologies.

He has raised over $20 million worth of research projects. Wong and his students continue to contribute in the field of materials development and processing, receiving more than 25 Outstanding and Best Paper Awards from the Institute of Electrical and Electronics Engineers (IEEE) and the International Microelectronics and Packaging Society (IMAPS) since 1996.

An IEEE Fellow, he is past president of the IEEE Components, Packaging and Manufacturing Technology Society and received its Outstanding Sustained Technical Contributions Award. He also is the recipient of the IEEE Educational Activities Board Meritorious Achievement Award in Continuing Education and the IEEE Third Millennium Medal. He was a Fellow of AT and T Bell Labs and is a member of the National Academy of Engineering.

Wong received his bachelor's and master's degrees in chemistry from Purdue University and his doctoral degree in chemistry from Pennsylvania State University. He was also a postdoctoral scholar at Stanford University.


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